200 mbd low-cost sbcon multimode fiber transceiver technical data features ? compliant with ibm enterprise systems connection (escon) architecture ? compliant to sbcon draft specification (dpans x3.xxx-199x rev 2.2) ? low radiated emissions and high immunity to conducted noise ? multi-sourced 4 x 7 package style with escon duplex connector interface ? wave solder and aqueous wash process compatible ? manufactured in an iso 9001 certified facility ? 1300 nm led-based transceiver applications ? interconnection with ibm compatible processors, directors, and channel attachment units C disk and tape drives C communication C controllers ? data communication equipment C local area networks C point-to-point C communication note: ibm, enterprise system connection architecture, escon, are registered trademarks of international business machines corporation. description the HFBR-5320 sbcon transceiver from agilent provides system designers with a product to implement a range of solutions compliant with the ibm enterprise system connection (escon) architecture. transmitter section the transmitter section of the HFBR-5320 utilizes 1300 nm surface emitting ingaasp led. the led is packaged in an optical sub-assembly within the transmitter section. the led is driven by a custom silicon ic which converts differential pecl logic signals [ecl referenced (shifted) to a +5 volt supply] into an analog led drive current. receiver section the receiver section of the HFBR-5320 utilizes an ingaas pin photodiode coupled to a custom silicon transimpedance preamplifier ic. this pin/ preamplifier combination is coupled to a custom quantizer ic which provides the final pulse shaping for the logic data output and status flag function. the data and status flag outputs are differential pecl compatible [ecl referenced (shifted) to a +5 volt power supply] logic outputs. package the overall package concept for the agilent transceiver consists of the following basic elements: two optical sub-assemblies, an electrical sub-assembly and the housing with an integral duplex sbcon connector receptacle. this illustrated in figure 1. the package outline and pin-out are shown in figures 2 and 3. the package includes internal shields for the electrical and optical sub-assemblies to ensure low emi emissions and high immunity to emi fields. HFBR-5320
2 the optical sub-assemblies utilize a high-volume assembly process together with low-cost lens technical understanding associated with this transceiver. you can contact them through solder and wash process compatibility the transceiver is delivered with a protective process plug inserted into the duplex sbcon connector receptacle. this process plug protects the optical sub- assemblies during wave solder and aqueous wash processing and acts as a dust cover during shipping. these transceivers are compatible with either industry standard wave or hand soldering processes. the process plug part number is hfbr-5002. shipping container the transceiver is packaged in a shipping container designed to protect it from mechanical and esd damage during shipment or storage. board layout - decoupling circuit and ground planes it is important to take care in the layout of your circuit board to achieve optimum performance from the transceiver. figure 3 provides a good example of a schematic for a power supply decoupling circuit that works well with this part. it is further recommended that a contiguous ground plane be provided in the circuit board directly under the transceiver to provide a low inductive ground for signal return current. this recommendation is in keeping with good high- frequency board layout practices. note: ultem is a registered trademark of general electric corporation. elements which result in a cost- effective building block. the electrical subassembly consists of a high-volume multi- layer printed circuit board on which the ic circuits and various surface-mount passive circuit elements are attached. the outer housing, including the sbcon-compliant duplex connector receptacle, is molded of filled, non-conductive ul 94v- 0 flame retardant ultem plastic (u.l. file e121562) to provide mechanical strength and electrical isolation. the transceiver is attached to a printed circuit board with 28 signal pins (4 rows of 7 pins) and with the four slots on the flanges which are located on the package sides. these four slots on the flanges provide the primary mechanical strength to withstand the loads imposed by the duplex connectored fiber cables. applications information the applications engineering group in the agilent optical communications division is available to assist you with the your local agilent sales representative. agilent led technology has produced 1300 nm led devices with lower aging characteristics than normally associated with these technologies in the industry. the industry convention is 1.5 db aging for 1300 nm leds. the agilent led will normally experience less than half this amount of aging over normal, commercial equipment mission-life periods. contact your local agilent sales representatives for additional details. recommended handling precautions it is advised that normal, anti- static precautions be taken in the handling and assembly of these transceivers to prevent damage which may be induced by electrostatic discharge (esd). the HFBR-5320 transceiver meets mil-std-883c method 3015.4 class 2. care should be used to avoid shorting the receiver data or status flag outputs directly to ground without proper current limiting impedance. figure 1. block diagram. data out signal
detect out data in electrical subassembly quantizer ic driver ic top view pin
photodiode duplex
receptacle optical
subassemblies led preamp
ic differential differential differential
3 regulatory compliance this transceiver product is intended to enable commercial system designers to develop equipment that complies with the various international regulations governing certification of information technology equipment. see the regulatory compliance table for details. additional information is benches, and floor mats in esd controlled areas. the second case to consider is static discharges to the exterior of the equipment chassis containing the transceiver parts. to the extent that the sbcon- compatible duplex connector receptacle is exposed to the outside of the equipment chassis, available from your local agilent sales representative. electrostatic discharge (esd) there are two design cases in which immunity to esd damage is important. the first case is during handling of the transceiver prior to mounting it on the circuit board. it is important to use normal esd handling precautions for esd sensitive devices. these precautions include using grounded wrist straps, work it may be subject to whatever esd system level test criteria that the equipment is intended to meet. electromagnetic interference (emi) most equipment designs utilizing this high-speed transceiver from agilent will be required to meet the requirements of fcc in the united states, cenelec en55022 (cispr 22) in europe and vcci in japan. this device is suitable for a variety of applications utilizing the ibm escon / sbcon architecture. immunity equipment utilizing this transceiver will be subject to radio- frequency electromagnetic fields in some environments. this transceiver has a high immunity to such fields. ordering information the HFBR-5320 1300 nm sbcon- compatible transceiver is available for production orders through the agilent component field sales offices and authorized distributors worldwide. all HFBR-5320 led transmitters are classified as iec-825-1 accessible emission limit (ael) class 1 based upon the current proposed draft scheduled to go into effect on january 1, 1997. ael class 1 led devices are considered eye safe. regulatory compliance table feature test method performance electrostatic discharge (esd) to mil-std-883c meets class 2 (2000 to 3999 volts) withstands up the electrical pins method 3015.4 to 2200 v applied between electrical pins. electrostatic discharge (esd) to variation of iec 801-2 typically withstand at least 25kv without damage the duplex sbcon receptacle when the duplex sbcon connector receptacle is contacted by a human body model probe. electromagnetic interference fcc class b typically provide a 20 db margin to the noted (emi) cenelec en55022 standard limits when tested at a certified test range class b (cispr 22b) with the transceiver mounted to a circuit card vcci class 2 without a chassis enclosure. immunity variation of iec 801-3 typically show no measurable effect from a 10v/m field swept from 10 to 450 mhz applied to the transceiver when mounted to a circuit card without a chassis enclosure.
4 absolute maximum ratings parameter symbol min. typ. max. unit reference storage temperature t s C40 100 c lead soldering temperature t sold 260 c lead soldering time t sold 10 sec. supply voltage v cc C0.5 7.0 v data input voltage v i C0.5 v cc v differential input voltage v d 1.4 v note 1 output current i o 50 ma recommended operating conditions parameter symbol min. typ. max. unit reference ambient operating temperature t a 070 c supply voltage v cc 4.75 5.25 v data input voltage - low v il - v cc C1.890 C1.475 v data input voltage - high v ih - v cc C1.165 C0.810 v data and status flag output load r l 50 w note 2 transmitter electrical characteristics (t a = 0 c to 70 c, v cc = 4.75 v to 5.25 v) parameter symbol min. typ. max. unit reference supply current i cc 145 185 ma note 3 power dissipation p diss 0.76 0.97 w data input current - low i il C350 m a data input current - high i ih 350 m a threshold voltage v bb - v cc C1.42 C1.3 C1.24 v note 21 receiver electrical characteristics (t a = 0 c to 70 c, v cc = 4.75 v to 5.25 v) parameter symbol min. typ. max. unit reference supply current i cc 100 125 ma note 4 power dissipation p diss 0.3 0.5 w note 5 data output voltage - low v ol - v cc C1.890 C1.620 v note 6 data output voltage - high v oh - v cc C1.060 C0.810 v note 6 data output rise time t r 0.35 1.3 ns note 7 data output fall time t f 0.35 1.3 ns note 7 status flag output voltage - low v ol - v cc C1.890 C1.620 v note 6 status flag output voltage - high v oh - v cc C1.060 C0.810 v note 6 status flag output rise time t r 0.35 2.2 ns note 7 status flag output fall time t f 0.35 2.2 ns note 7
5 transmitter optical characteristics (t a = 0 c to 70 c, v cc = 4.75 v to 5.25 v) parameter symbol min. max. unit reference output optical power p o bol C20.5 C15.0 dbm note 9 62.5 / 125 m m, na = 0.275 fiber p o eol C21.5 avg. optical extinction ratio 8 db note 22 center wavelength l c 1280 1380 nm spectral width - fwhm dl 175 nm note 11 optical rise time t r 1.7 ns note 10, 12 optical fall time t f 1.7 ns note 10, 12 output optical systematic t sj 0.8 ns note 13 jitter p-p receiver optical and electrical characteristics (t a = 0 c to 70 c, v cc = 4.75 v to 5.25 v) parameter symbol min. max. unit reference input optical power p in min. p in min. (c) dbm avg. note 14 minimum at window edge (w) + 1.0 db input optical power p in min. C29.0 dbm avg. note 15 minimum at eye center (c) input optical power maximum p in max. C14.0 dbm avg. note 14 operating wavelength l 1280 1380 nm systematic jitter sj 1.0 ns p-p note 16 eyewidth t ew 1.4 ns note 8 status flag - asserted p a C44.5 C35.5 dbm avg. note 17 status flag - deasserted p d C45 C36 dbm avg. note 17 status flag - hysteresis p a - p d 0.5 db note 18 status flag assert time t a 3 500 m s note 19 (off-to-on) signal detect deassert time t d 3 500 m s note 20 (off-to-on)
6 notes: 1. this is the maximum voltage that can be applied across the differential transmitter data inputs to prevent damage to the input esd protection circuit. 2. the outputs are terminated with 50 w connected to v cc C2 v. 3. the power supply current needed to operate the transmitter is provided to differential ecl circuitry. this circuitry maintains a nearly constant current flow from the power supply. constant current operation helps to prevent unwanted electrical noise from being generated and conducted or emitted to neighboring circuitry. 4. this value is measured with the outputs terminated into 50 w connected to v cc C2 v and an input optical power level of C 14.5 dbm average. 5. the power dissipation value is the power dissipated in the receiver itself. power dissipation is calculated as the sum of the products of supply voltage and currents, minus the sum of the products of the output voltages and currents. 6. this value is measured with respect to v cc with the output terminated into 50 w connected to v cc C2 v. 7. the output rise time and fall times are measured between 20% and 80% levels with the output connected to v cc C 2 v through 50 w . 8. eye-width specified defines the minimum clock time-position range, centered around the center of the 5 ns baud interval, at which the ber must be 10 C12 or better. test data pattern is prbs 2 7 C 1. the maximum change in input optical power to open the eye to 1.4 nsec from a closed eye is 1.0 db. 9. these optical power values are measured with the following conditions: ? the beginning of life (bol) to the end of life (eol) optical power degradation is assumed to be 1.5 db per the industry convention for long wavelength leds. the actual degradation observed in normal commercial environments will be <1.0 db with agilents 1300 nm led products. ? over the specified operating voltage and temperature ranges. ? input signal: 2 7 C1 data pattern pseudorandom bit-stream, 200 mbit/sec nrz code. 10. input conditions: 100 mhz, square wave signal, input voltages are in the range specified for v il and v ih . 11. from an assumed gaussian-shaped wavelength distribution, the relationship between fwhm and rms values for spectral width is 2.35 x rms = fwhm. 12. measured with electrical input signal rise and fall time of 0.35 to 1.3 ns (20-80%) at the transmitter input pins. optical output rise and fall times are measured between 10% and 90% levels. 13. transmitter systematic jitter is equal to the sum of duty cycle distortion (dcd) and data dependent jitter (ddj). dcd is equivalent to pulse- width distortion (pwd). systematic jitter is measured at the 50% signal level with 200 mbd, prbs 2 7 C1 electrical input data pattern. 14. this specification is intended to indicate the performance of the receiver section of the transceiver when input optical power signal characteristics are present per the following conditions. the input optical power dynamic range from the minimum level (with a window time-width) to the maximum level is the range over which the receiver is guaranteed to provide output data with a bit error ratio (ber) better than or equal to 10 C15 . ? at the beginning of life (bol). ? over the specified operating temperature and voltage ranges. ? receiver data window time-width is 1.4 ns or greater and centered at mid-symbol. ? input signal is 200 mbd, pseudorandom-bit-stream 2 7 C1 data pattern. ? transmitter cross-talk effects have been included in receiver sensitivity. transmitter should be running at 50% duty cycle (nominal) between 8 - 200 mbps, while receiver sensitivity is measured. 15. all conditions of note 14 apply except that the measurement is made at the center of the symbol with no window time-width. 16. the receiver systematic jitter specification applies to optical powers between C 14.5 dbm avg. to C 27.0 dbm avg. at the receiver. receiver systematic jitter is equal to the sum of duty cycle distortion (dcd) and data dependent jitter (ddj). dcd is equivalent to pulse- width distortion (pwd). systematic jitter is measured at the 50% signal level with 200 mbd, prbs 2 7 C1 electrical output data pattern. 17. status flag switching thresholds: direction of decreasing optical power if power >C36.0 dbm avg., then sf = 1 (high) if power C35.5 dbm avg., then sf = 1 (high) 18. status flag hysteresis is the difference in low-to-high and high-to- low switching thresholds. thresholds must lie within optical power limits specified. the hysteresis is desired to avoid status flag chatter when the optical input is near the threshold. 19. the status flag output shall be asserted with 500 m s after a step increase of the input optical power. the step will be from a low input optical power C35.5 dbm avg. 20. status flag output shall be de- asserted within 500 m s after a step decrease in the input optical power. the step will be from a high input optical power >C 36.0 dbm avg. to 7 figure 2. package outline drawing. 45.75 hfbr-5xxx
date code (yyww)
singapore 76.26 max. gnd gnd gnd gnd gnd gnd v bb 7 1 gnd v cc v cc gnd gnd data data 14 20 v cc3 nc gnd v cc1 gnd data data gnd gnd gnd gnd gnd sf sf 27 21 34 40 (2x) 10.16 (2x) 3.81 35.20 17.78 (7x) 2.54 (28x) ? 0.48 (2x) 15.88 4.05 ?0.1 20.15 process plug card
mount
surface 11.57
max. 0.40 (4x) 19.00 17.78 3.8 ?0.1 45 8.89 3.60 ?0.25 top view bottom view (2x) ? 2.50 notes:
1. all dimensions are millimeters.
2. all dimensions are nominal unless otherwise specified.
3. the leads are tin-lead (90/10) plated phosphor bronze.
4. label information refer to ?5. a a
notes: 1. resistance is in ohms. capacitance is in microfarads. inductance is in microhenries. 2. terminal transmitter input data and data-bar at the transmitter input pins. terminate the receiver output data, data-bar, status flag, and status flag-bar at the follow-on device input pins. for lower power dissipation in the status flag termination circuitry with small compromise to the signal quality, each status flag output can be loaded with 510 ohms to ground instead of the two resistor, split -load pecl termination shown in the figure 3 schematic. 3. make differential signal paths short and same length with equal termination impedance. 4. signal traces should be 50 ohms microstrip or stripline transmission lines. use multilayer, ground-plane printed circuit board for best high-frequency performance. 5. use high-frequency, monolithic ceramic bypass capacitors and low series dc resistance inductors. recommend use of surface- mount coil inductors and capacitors. in low noise power supply systems, ferrite bead inductors can be substituted for coil inductors. locate power supply filter components close to their respective power supply pins. 6. device ground pin should be directly and individually connected to ground. 7. caution: do not directly connect the fiber-optic module pecl outputs (data, data-bar, status flag, status flag-bar, v bb ) to ground without proper current limiting impedance. figure 3. v bb +5 v 0.1 ? 82 w 82 w 130 w 130 w +5 v 0.1 ? 82 w 82 w 130 w 130 w +5 v 0.1 ? 82 w 130 w 82 w 130 w 0.1 ? 0.1 ? +5 v td td rd rd sf sf 0.1 ? 10 ? gnd gnd gnd gnd gnd gnd data data gnd v cc gnd nc v cc data data gnd gnd v cc v cc gnd sf sf gnd gnd gnd gnd gnd 1 7 40 34 14 21 27 20 4 x 7 pins
required HFBR-5320
(top view) nc = no internal connection 1 ? 1 ? www.semiconductor.agilent.com data subject to change. copyright ? 1999 agilent technologies, inc. 5965-5256e (11/99)
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